Application analysis of screen printing in the pro

2022-10-16
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Analysis on the application of silk printing in the production of printed circuit boards (IV)

III. thoughts on high-tech silk printing

1 The tortuous and painful process of silk printing penetrating into the high-tech PCB manufacturing industry shows that if the "skill" of silk printing itself is not strong, it will not do much; If silk printing wants to expand to the high-tech field, it must first make itself high-tech. This so-called high-tech is the innovation of materials, equipment and technology of silk printing. Only the high scientific and technological content of silk printing itself can make silk printing freely display its strength in the high-tech field. The application of silk printing in PCB manufacturing technology strongly proves that only silk printing with deep "internal skills" can "dance" with PCB. This is true of silk printing in the PCB industry, as well as in other high-tech fields, including the fields we will explore that have not been involved in silk printing at present

2. Innovation goes beyond

as the saying goes, "water is impermanent", this is because everything in the world is not absolutely static, but relatively moving. Change is temporary, while change is absolute. Because of this, the achievements or established advantages of silk printing in PCB industry and other high-tech fields cannot be permanent. In terms of PCB manufacturing, at present, this traditional process of making PCB by copper foil etching is being criticized by more and more experts and scholars, because the focus of the largest enterprise in this process is on how to build on the national standards. The defects are:

(1) the process is complex

(2) large investment in process equipment

(3) pollution to the environment and harm to the operator's body during the process

at present, the new process requirements for PCB manufacturing are as follows

(1) the process of laying copper foil on PCB substrate and a large amount of equipment investment to realize this process can be avoided by using specially manufactured paperboard instead of copper foil. At the same time, it can also prevent the waste of resources (metal copper) caused by etching in the traditional process, the difficulty of copper recovery and the large amount of money invested in resource reuse (copper recovery)

(2) avoid the operating environment of chemical solutions (such as electroplating solution, etching solution, etc.) to the greatest extent, so as to simplify the process and eliminate pollution

at present, this bold idea is by no means impossible to achieve. However, what is the best way to realize the new process of 1.4.1 with digital anemometer installed on the upper part of the experimental box to ensure that the flow rate of wind is less than 8m/s? In my humble opinion, the best and most promising method is silk printing. That is, the conductive pattern (printed circuit) is printed directly on the special cardboard (PCB substrate) by the silk printing process. In other words, the production of the printed conductive pattern of PCB in the future is printed by silk. More ideally, due to the excavation of the depth of silk printing to the inner layer, silk printing is used to "wrap the angel stage up and down" or mainly silk printing in PCB manufacturing; The existing traditional PCB manufacturing processes such as electroless copper plating, copper plating or bright copper plating, lead tin alloy plating, etching and even lamination tend to disappear (completely and completely eliminated)

The proposal of the new printing production mode of PCB is not only an excellent development opportunity given by modern high technology to silk printing, but also a severe challenge to the silk printing industry. Facing the future PCB manufacturing industry with huge business opportunities and excellent social and economic benefits, how can people in the silk printing industry not be excited! However, it's meaningless just to move. People often say that "action is better than moving"? Yes, facing the attractive prospect of PCB manufacturing, the most important thing for Indians at present is to take action. This action is to innovate new printing materials, equipment and processes to meet the high-tech needs of the future. In fact, in today's high-tech field, among the three strategic projects in the 21st century (Information Engineering, bioengineering, financial engineering) that are considered by many futurists by many foreign major outsourcing parts, silk printing can participate in it and dance with high technology. The question is whether we have the consciousness and courage to explore the high-tech field that silk printing has not yet been involved in! For new high-tech silk printing topics, are we going to organize, implement and tackle key problems. In the current silk printing industry, there is a special need for a group of people with vision and innovation

silk printing in China used to be brilliant in the past. The first generation of Chinese printers made great contributions to the beginning and development of printing technology in the world and the civilization of human society. As a new generation of printers today, we should revitalize China's silk printing industry; We should recast the brilliance of Chinese printing technology in the new century; To make greater contributions to the printing technology of the future world, we should strive to inherit and carry forward our ancestors' courage to innovate and the down-to-earth spirit of hard work. Innovation is the key to recast brilliance; To recast brilliance, we should seize the time, "the opportunity is not lost, I will wait until it is lost". Today, we have clearly heard the footsteps of the 21st century. Chinese Indian workers who are about to enter the era of knowledge economy and participate in the competition in the international environment should always keep in mind: "how many things are always urgent, the world changes, time is pressing, 10000 years is too long, seize the day". Innovation is the soul of silk printing progress

(to be continued)

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